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Highly Efficient 3G Connectivity in a 2G Footprint

Thales's Cinterion® EHS5 delivers highly efficient 3G connectivity in an ultra-compact footprint featuring high-speed data communication with 7.2 Mbps (max) in the downlink and 5.76 Mbps (max) in the uplink. 

It is ideal for M2M applications moving to 3G technology with a focus on long-lasting, future proof and cost-efficient M2M applications.

Offering a backward and forward compatible footprint, its multi-design capability offers seamless migration and unmatched flexibility to choose frequency bands and global roaming whenever needed.

The module incorporates an improved Java concept using Multi MIDlet Java execution to simultaneously host and run multiple applications and protocols.

An extended security concept with the latest TLS/SSL engine provides secure and reliable TCP/IP connectivity while an enriched internal flash file system enables royalty-free firmware updates over-the-air (FOTA) when required.

Sophisticated sandbox modelling and layered architectures simplify development allowing simultaneous progress of both devices and software applications for a shorter time to market.

The tiny module's LGA (Land Grid Array) package is perfectly suited to the process manufacturing needs of high-volume M2M devices with a focus on reliable and efficient processes. 

EHS5 is available in two variants: EHS5-US (850/1900 MHz) for North America and EHS5-E (900/2100 MHz) for the rest of the world.

SnapEDA Schematic Symbol and PCB footprint

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