Highly Integrated MTC IoT Module Delivers Global NB-IoT, LTE M and 2G in a Tiny Things Footprint
The Cinterion® TX82 Wireless IoT Module is driving LTE evolution to 5G by providing global LTE-M, NB-IoT, and 2G connectivity today while supporting 3GPP Rel. 14 and 5G for next-generation capabilities tomorrow. The TX82 is packed with powerful features, including embedded processing, eSIM, GNSS, and state-of-the-art security to lower TCO and protect your IoT investment. It comes in the compact and scalable Things footprint engineered for multi design flexibility and it’s ideal for small, battery operated devices including smart meters, asset trackers, healthcare apps and wearables.
Highly efficient global MTC connectivity
Delivering highly efficient LTE-M, NB-IoT and 2G connectivity, the Cinterion TX82 ensures worldwide cellular coverage and an extended coverage range while simultaneously reducing power consumption by supporting 3GPP power modes such as PSM and eDRX.
Highly integrated with Cinterion IoT SDK for embedded processing
The highly integrated MTC module features embedded processing and a comprehensive set of APIs running on a Real-Time Operating System (RTOS). Embedded GNSS supports small tracking devices and a range of peripherals that connect to any sensor.
Thales eSIM simplifies and secures IoT connectivity
A Thales eSIM integrated during manufacturing strengthens security, authenticates devices, encrypts data and securely manages connections to cellular networks. The eSIM works seamlessly with the Cinterion IoT Suite to provide remote connectivity management over the long lifecycle of devices. It also simplifies integration, manufacturing, and logistics for IoT developers while enabling smaller designs.
Streamlining the device-to-cloud journey
The platform leverages unique digital IDs inherent to each Cinterion IoT Module along with a secure digital handshake to verify the authenticity of devices and applications. This allows streamlined and swift enrollment in any major IoT cloud platform. This further simplifies development and manufacturing, eliminating the need for OEMs to provide their own secure production facilities.